How about contract with Elon Musk to launch into orbit on Space-X, and in the zero oxygen upper atmosphere, wire brush and THEN apply no-ox?
That'll work too.
But somewhat more practical is to put the part in load-lock, pump down, transfer to wafer processing chamber, use ion etch to remove oxide. Then vapor or sputter deposit a non-corroding metal (with stick layers first, if necessary.)
We used aluminum, sometimes pure, sometimes with silicon or other elements, for wafer interconnect. The native oxide made a good stick layer for PECVD SiO2 and SiN. Bare aluminum bond pads of course oxidized, but ultrasonic wedge bonding broke through.
Copper interconnect was "better" but a huge development effort, needed adhesion layers, got its own oxides if not coated, etc.
The company spent years pushing its copper MCM interconnect, before realizing that the simple and high yielding aluminum one performed pretty well.
PG&E just crimps terminals onto stranded aluminum wire. Might put a corrosion inhibitor in there, but I don't think there is much prep. Certainly not for inner stands (which I have done for screw terminal splices.) Crimping breaks the oxide and mashes metal together.
Battery terminals? They're supposed to be laser welded like G*d (I mean BYD, CALB, and all the demi-g*ds of lithium) intended.
I'm supposed to have some packs on the way. The cells have laser welded busbars joining them, and the end terminals with studs appear to be plated.